Project

PARTICIPANTS

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Apollon Solar

Apollon Solar s.a.s (AS) is a private R&D company with the legal status of a simplified joint stock company based in Lyon, France. It is part of the French private YRIEL group that has industrial activities in the chemical and energy sector. YRIEL is the majority shareholder of AS.

AS was launched in July 2001 by a team of specialist with long term experience in different fields of the photovoltaic industry, including R&D, engineering and marketing. AS offers scientific, technical, technological and marketing solutions to substantially reduce the cost of photovoltaic solar energy. In order to take innovation solutions through to market launch, AS establishes partnerships with industry and leading laboratories, not always directly involved in PV. AS has a proven, successful track record in collaborative R&D projects related to PV, both on national and international level

AS participates in this project proposal with its proprietary NICE (New Industrial Cell Encapsulation) technology for high efficient and high reliable PV modules. NICE has been invented by AS and further developed to an industrial level by a consortium led by AS, comprising major R&D institutes and an industrial manufacturer of automated production lines. Based on learning experiences of a first generation automated NICE module production line a second generation NICE module production line with a completely revised architecture is currently under development. This new production line will increase performance, allow for a higher flexibility of cell architectures and module formats, while keeping cost of ownership and industrial food print at a low level. In this project, Apollon Solar will collaborate mainly with SINTEF on the PV parts of the BIPV elements, focusing on costs, interfaces and integration with the other parts of the BIPV elements, and improving the esthetics/visual appearance. Another focus will be on a high eco efficiency at (environmentally friendly BOM, strongly reduced resource consumption and the possibility to disassemble end of life modules into components).